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1

Review of the application of hydraulic technology in wind turbine

Chen, Wenting, Wang, Xiaoyun, Zhang, Fusen, Liu, Hongwei, Lin, Yonggang

Journal:

Year:

2020

File:

PDF, 19.99 MB

2020

2

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Crystal-free and low-flow-angle ILD by using in situ SACVD/PE BPSG for 0.5-um application

Yen, Hung-Chi, Jin, Ben-Yih, Wong, Cliff, Chow, Peter, Yen, Daniel, Hu, Joseph, Su, Joe S., Wang, Jean, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 299 KB

english, 1994

3

Design and Implementation of an Indoor light supplement control system based on STM32 microcontroller

Yuan, Fusen, Zhao, Xuchen, Chen, Hao, Ming, Yue, Zhang, Jie

Journal:

Journal of Physics Conference Series

Year:

2020

File:

PDF, 788 KB

2020

4

Oxidation of Ta diffusion barrier layer for Cu metallization in thermal annealing

Kai-Min Yin, Li Chang, Fu-Rong Chen, Ji-Jung Kai, Cheng-Cheng Chiang, Graham Chuang, Peijun Ding, Barry Chin, Hong Zhang, Fusen Chen

Journal:

Thin Solid Films

Year:

2001

Language:

english

File:

PDF, 1.87 MB

english, 2001

5

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Wirebond pull test failures at rapid thermal processes (RTP) TiN/BPSG interface

O'Meara, David L., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 1.04 MB

english, 1994

6

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V - Characterization of PECVD Ti process and development of a plasma-less chlorine clean for process repeatability in advanced DRAM manufacturing

Bhan, Mohan, Wu, Fred H., Srinivas, R. A., Metzger, Brian, Lando, Zvi, Narasimhan, Murali K., Chen, Fusen E., Toprac, Anthony J., Dang, Kim

Year:

1999

Language:

english

File:

PDF, 440 KB

english, 1999

7

The effect of oxygen in the annealing ambient on interfacial reactions of Cu/Ta/Si multilayers

Kai-Min Yin, Li Chang, Fu-Rong Chen, Ji-Jung Kai, Cheng-Cheng Chiang, Peijun Ding, Barry Chin, Hong Zhang, Fusen Chen

Journal:

Thin Solid Films

Year:

2001

Language:

english

File:

PDF, 1.80 MB

english, 2001

8

Male urinary incontinence Correction with ischiocavernous muscles collaring method

Journal:

Year:

1974

Language:

english

File:

PDF, 481 KB

english, 1974

9

Deposition of copper by using self-sputtering

Fu, Jianming, Ding, Peijun, Dorleans, Fernand, Xu, Zheng, Chen, Fusen

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1999

Language:

english

File:

PDF, 759 KB

english, 1999

10

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Chemical mechanical planarization of multilayer dielectric stacks

Jain, Manoj K., Dixit, Girish A., Chisholm, Michael F., Seha, Thomas R., Taylor, Kelly J., Shinn, Gregory B., Havemann, Robert H., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 487 KB

english, 1994

11

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Copper interconnection schemes: elimination of the need of diffusion barrier/adhesion promoter by the use of corrosion-resistant low-resistivity-doped copper

Murarka, Shyam P., Neirynck, J. M., Lanford, William A., Wang, W., Ding, Pei-jun, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 809 KB

english, 1994

12

[IEEE 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. - Beijing, China (Oct. 18-21, 2004)] Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. - Advanced Cu barrier/seed development for 65nm technology beyond

Peijun Ding,, Gopalraja, P., Jianming Fu,, Jick Yu,, Zheng Xu,, Fusen Chen,

Year:

2004

Language:

english

File:

PDF, 814 KB

english, 2004

13

Sub-Quarter Micron Metallization Using Ionized Metal Plasma Technology

Chen, Fusen, Xu, Zheng, Sinha, Ashok

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 3.00 MB

english, 1998

14

Ambient Dependence of Agglomeration Stability of Cu/Ta Films

Hartman, J. W., Atwater, H. A., Hashim, Imran, Chin, Barry, Chen, Fusen

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 899 KB

english, 1998

15

TEM Analyses Of Cu-Ta And Cu-Tan Interfaces

Wang, J. Y. Phillip, Zhang, Hong, Hashim, Imran, Dixit, Girish, Chen, Fusen

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 3.37 MB

english, 1999

16

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Laser-induced microfracture leading to high-density metal-to-metal connections

Bernstein, Joseph B., Ventura, Thomas M., Radomski, Aaron T., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 808 KB

english, 1994

17

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Effects of tungsten deposition on site focal plane deviation

Coniff, John, Dellarochetta, Stephen, Von Salza Brown, Terry L., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 639 KB

english, 1994

18

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Comparison study between tungsten and aluminum plug for submicrometer contact via manufacturing

Gn, Fang H., Liu, Lianjun, Guo, Michael, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 792 KB

english, 1994

19

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Analysis and design considerations for manufacturable and reliable 0.18-micron N-MOSFETs

Krishnamurthy, Shyam, Jallepalli, S., Yeap, ChohFei, Hasnat, Khaled, Maziar, Christine M., Tasch, Jr., Al F., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 1.13 MB

english, 1994

20

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Planarization using chemical mechanical planarization (CMP) on a 16-megabit SRAM with quadruple polysilicon stacks

Perry, Kathleen A., Radhakrishna, Sandya, Lage, Craig, Nkansah, Franklin, Pol, Victor, Kobayashi, Thom, West, Jeff P., Crabtree, Phil, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 568 KB

english, 1994

21

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - New hot-carrier-resistant P-I-N MOSFET structure

Jung, Le-Tien, Manna, Indrajit, Bhattacharya, Swapan, Banerjee, Sanjay K., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 263 KB

english, 1994

22

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Planar multilevel metallization technologies for ULSI devices

Xu, Zheng, Ngan, Ken, VanGogh, Jim, Mosely, Rod, Tanaka, Yoichiro, Kieu, H., Chen, Fusen E., Raaijmakers, Ivo J., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 763 KB

english, 1994

23

SPIE Proceedings [SPIE Microelectronic Processing '93 - Monterey, CA (Sunday 26 September 1993)] Multilevel Interconnection: Issues That Impact Competitiveness - Triple-level metal process for high-performance and high-density 0.6-μm/5-V application-specific integrated circuits

Prasad, Sharad, Bruner, M., Chen, Fusen E., Gandhi, Mitan, Lu, Y. C., Kao, Chiyi Y., Yang, Steve, Hata, William, Hoang, Hoang H., Schutz, Ron, Bernstein, Joseph B., Vasquez, Barbara

Year:

1993

Language:

english

File:

PDF, 430 KB

english, 1993

24

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - New route to thermal dry-etching of copper using hydrogen peroside (H2O2) and hexafluoroacetylacetone (HFACH)

Jain, Ajay, Kodas, Toivo T., Hampden-Smith, Mark J., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 409 KB

english, 1994

25

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Three-dimensional laser micromachining

Li, Lijun, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 651 KB

english, 1994

26

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Manufacturing issues in copper chemical vapor deposition processes

Nguyen, Tue, Allen, Lynn R., Hsu, Sheng T., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 342 KB

english, 1994

27

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Chemical Vapor deposition (CVD) TiN: a barrier metallization for submicron via and contact applications

Littau, Karl A., Mosely, Rod, Eizenberg, M., Tran, Hung V., Sinha, Ashok K., Dixit, Girish A., Jain, Manoj K., Chisholm, Michael F., Havemann, Robert H., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 578 KB

english, 1994

28

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - New conception in transistor technology using nonhomogenous temperature field

Kaupuzs, J., Medvids, Arthur, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 1.02 MB

english, 1994

29

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Integrated IMP Ti and MOCVD TiN for 300-mm W barrier and liner for sub-0.18-μm IC processing

Tolia, Anish, Menezes, Marlon, Li, Jason, Jackson, Michael, Pavate, Vikram, Khurana, Nitin, Mosely, Rod, Narasimhan, Murali K., Chang, Mei, Chen, Fusen E., Graef, Mart, Patel, Divyesh N.

Year:

1999

Language:

english

File:

PDF, 410 KB

english, 1999

30

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Plasma etching of high-temperature-deposited AlSiCu for submicron ULSI manufacturing

Liu, Lianjun, Gn, Fang H., Chu, Ronfu, Wei, Che-Chia, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 719 KB

english, 1994

31

SPIE Proceedings [SPIE International Symposium on Optical Science and Technology - San Diego, CA (Sunday 29 July 2001)] Engineering Thin Films with Ion Beams, Nanoscale Diagnostics, and Molecular Manufacturing - Nanoscale-level dielectric property image of low-k dielectric materials for copper metallization using energy-filtered TEM

Lo, Shen-Chuan, Chen, Fu-Rong, Kai, Ji-Jung, Chen, Li-Chien, Chang, Li, Chiang, Cheng-Cheng, Ding, Peijun, Chin, Barry, Chen, Fusen E., Knystautas, Emile J., Kirk, Wiley P., Browning, Valerie

Year:

2001

Language:

english

File:

PDF, 833 KB

english, 2001

32

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Issues associated with submicron via formation

Brown, Kevin C., Alarcon, Estrella, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 726 KB

english, 1994

33

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - High-quality sub-5-nm oxynitride dielectric films grown on silicon in a nitric oxide ambient using rapid thermal processing

Yao, Ze-Qiang, Harrison, H. Barry, Dimitrijev, Sima, Yeow, Y. T., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 495 KB

english, 1994

34

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Analytic models and parametric investigations of IBE and RIE mechanisms for GaAs compounds

Ketata, K., Koumetz, Serge, Ketata, Mohamed, Debrie, Roland, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 351 KB

english, 1994

35

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology

Liao, De-Dui, Lin, Yih-Shung, Yang, Hong, Witham, Howard, Saenz, Javier, May, Jeff S., Lee, Jen-Jiang J., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 645 KB

english, 1994

36

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Improved aluminum plug process for submicron via filling

Yang, Hong, Lin, Yih-Shung, Nguyen, Loc, Liao, De-Dui, Worley, J., Smith, Greg, Liou, Fu-Tai, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 424 KB

english, 1994

37

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Capping layers, cleaning method, and rapid thermal processing temperature on cobalt silicide formation

Saigal, Dinesh, Lai, Gigi, Yang, Lisa, Su, Jingang, Ngan, Ken, Narasimhan, Murali K., Chen, Fusen E., Singhal, Ajay, Lopes, Dave, Lian, Sean, Cao, Wanqing, Tsai, Kevin, Lo, Patrick, Lee, Shih-Ked, Shi

Year:

1999

Language:

english

File:

PDF, 1.16 MB

english, 1999

38

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Spin-on-glass (SOG) partial etch-back planarization process with 0.4-um gap filling ability

Bacchetta, Maurizio, Zaccherini, Chiara, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 766 KB

english, 1994

39

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - High rate premetallization sputter etching of submicron vias using a high-density dual-frequency plasma source

Chen, Eldon, Hsieh, Sunnys, Lin, Ting-Huang, Narasimhan, Murali K., Mueller, Mark, Egermeier, John C., Proulx, George, Ling, Yen L., Wang, Jean, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 463 KB

english, 1994

40

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Submicron-size laser treatment of the solid state surface

Valyavko, Vasily V., Osipov, Vladimir P., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 377 KB

english, 1994

41

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Surface charging effect on microloading for sub-quarter-micron contact etching

Shin, Ki-Soo, Park, Hae-Sung, Choi, Soo-Han, Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 622 KB

english, 1994

42

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Thin-gate dielectric films grown in N<sub>2</sub>O and O<sub>2</sub> using rapid thermal oxidation

Grant, John M., Hsieh, Tzu Y., Shannon, Victoria L., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 756 KB

english, 1994

43

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Analysis and modeling of submicron drain-offset polysilicon thin film transistors (TFTs)

Damiano, Jr., John, Jung, Le-Tien, Banerjee, Sanjay K., Batra, S., Manning, M., Dennison, C., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 425 KB

english, 1994

44

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Enabling and cost-effective TiCl 4 -based PECVD Ti and CVD TiN processes for gigabit DRAM technology

Srinivas, Sri, Graef, Mart, Patel, Divyesh N., Xi, Ming, Metzger, Brian, Lando, Zvi, Narasimhan, Murali K., Chen, Fusen E.

Year:

1999

Language:

english

File:

PDF, 474 KB

english, 1999

45

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Model for the growth of oxides in N<sub>2</sub>O

Dimitrijev, Sima, Harrison, H. Barry, Sweatman, Denis R., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 646 KB

english, 1994

46

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Characterization of a high-quality and UV-transparent PECVD silicon nitride film for nonvolatile memory applications

Wang, Chin K., Ying, T. L., Wei, C. S., Liu, L. M., Cheng, Huang-Chung, Lin, M. S., Chen, Fusen E., Murarka, Shyam P.

Year:

1994

Language:

english

File:

PDF, 445 KB

english, 1994

47

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 μm W based metallization schemes for >500 MHz microprocessors

Khurana, Nitin, Pavate, Vikram, Jackson, Michael, Mandrekar, T., Fang, Z., Tolia, Anish, Luo, H., Li, Jason, Mosely, Rod, Narasimhan, Murali K., Chang, Mei, Chen, Fusen E., Graef, Mart, Patel, Divyesh

Year:

1999

Language:

english

File:

PDF, 668 KB

english, 1999

48

Ileal Replacement of the Ureter in Solitary Kidney

Dowd, Joseph B., Chen, Fusen

Journal:

Surgical Clinics

Year:

1971

Language:

english

File:

PDF, 4.66 MB

english, 1971

49

Effects of Pro-Arg, a Novel Dipeptide Derived from Protamine Hydrolysate on H2O2-Induced Oxidative Stress in Human Diploid Fibroblasts

Wang, Yonggang, Zhu, Fengrong, Chen, Jie, Han, Fusen, Wang, Heyao

Journal:

Biological & Pharmaceutical Bulletin

Year:

2009

Language:

english

File:

PDF, 271 KB

english, 2009

50

Development of an autonomous flapping-wing aerial vehicle

He, Wei, Huang, Haifeng, Chen, Yunan, Xie, Wenzhen, Feng, Fusen, Kang, Yemeng, Sun, Changyin

Journal:

SCIENCE CHINA Information Sciences

Year:

2017

Language:

english

File:

PDF, 1.34 MB

english, 2017

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